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April 21, 2024
SK hynix is joining hands with TSMC, the world’s top foundry, to develop High Bandwidth Memory 4 and cutting-edge packaging technology, the company said on Friday. Under the partnership agreement, the two sides plan to proceed with the development of HBM4, the sixth-generation model of the advanced memory chip, and enhance logic and HBM integration through advanced packaging technology, SK hynix said. "We expect a strong partnership with TSMC to help accelerate our efforts for open
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