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October 24, 2019

Apple to cut down on RFPCB in new OLED iPhones

PUBLISHED : April 04, 2018 - 16:14

UPDATED : April 05, 2018 - 10:55

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[ET NEWS] Apple has decided to cut down on the rigid flexible printed circuit board for upcoming new OLED iPhones, replacing the part with cheaper and less advanced multi-flexible printed circuit boards, according to industry sources on April 4. 

RFPCB is a key part of the iPhone X that connects chips with the display panel. The new OLED iPhones scheduled for debut in September are likely to use the multi-FPCB for the touch-screen panel, largely due to price and production benefits. 




Related:
Why Apple's investing in PCB equipment
Interflex shares on rollercoaster ride over Apple’s ‘frozen’ iPhone X


Currently, three Korean PCB makers -- LG Innotek, Interflex and Youngpoong Electronics -- are supply RFPCBs. But Apple had previously faced a myriad of problems involving RFPCBs. 

Before the iPhone X was launched, a Taiwanese supplier dropped out after failing to meet the quality criteria. Then, a faulty connection in the RFPCB module was cited as the cause for the so-called “frozen” iPhone X whose OLED screens would become unresponsive or inaccurate in cold weather. 

Apple eventually launched a probe that led to a temporary suspension at some parts plants.

It remains to be seen whether the US tech firm will get its current vendors increase its multi-FPCB supplies, get them to switch suppliers altogether or change suppliers.

One local PCB producer told ET News that it had considered supplying multi-FPCBs to Apple, but changed its mind because the proposed supply price was too low.

In the meantime, Apple plans to launch three new iPhones this year -- one LCD and two OLED models. It has been working on two 5.85-inch and 6.46-inch OLED screens together with Samsung Display.

By Yoon Kun-il (benyun@etnews)
This story was co-produced by ET News and The Investor

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